CM to lay stone for country’s 1st advanced chip packaging unit today
Odisha’s capital is set to host India’s first advanced 3D glass semiconductor packaging unit, a Rs 1,943 crore project by
Read moreOdisha’s capital is set to host India’s first advanced 3D glass semiconductor packaging unit, a Rs 1,943 crore project by
Read moreOne in four people in Odisha suffers from metabolic dysfunction-associated steatotic liver disease (MASLD), with obesity and diabetes identified as
Read moreHeatwave grips Odisha, prompting collectors in nine districts to close schools and anganwadis. The state government has issued an SOP,
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